ElectroCicla
Plantilla Stencil BGA Reballing AMAOE EMMC3 para Android Nand/Flash/EMMC/EMCP/UFS/LPDDR (BGA 60-254, PCIE)
Plantilla Stencil BGA Reballing AMAOE EMMC3 para Android Nand/Flash/EMMC/EMCP/UFS/LPDDR (BGA 60-254, PCIE)
Precio habitual
$12.921 CLP
Precio habitual
$15.921 CLP
Precio de oferta
$12.921 CLP
Precio unitario
por
Los gastos de envío se calculan en la pantalla de pago.
No se pudo cargar la disponibilidad de retiro
SPECIFICATIONS
Brand Name: NoEnName_Null
Certification: None
Hign-concerned Chemical: None
Model Number: EMMC3
Origin: Mainland China
Welcome to our store
We specialize in integrated circuit chips
If you need to purchase more models
Click on the“Add To Cart”
• Shipping Information
Items will be ship within3 daysof payment receive.
working days(2-4 weeks)to receive for most area.
If you do not receive item within 30 working days(5 weeks), please contact us to investigate the case.
The soldering process is complicated,oldering/replacing chips must be operated by engineers who have proficient skills.
As BGA chips are fragile, complicatedly structured, with numerous balls
any slightly faulty positioning
careless temperature-control or incomplete cleaning PCB boards will result in insufficient soldering or missing soldering.
BGA chips are easily get broken by improper soldering. Before buying, you should consider 3 points:
1) Have you bought the right chips?
2) Do you have proper equipment?
3) Are you skillful enough to solder the chips?
