ElectroCicla
Plantilla Stencil BGA Reballing para Samsung A13/A21S/A33/A53(A536)/F13/M33 (CPU Exynos1280/E8825/Exynos850/3830, RAM, EMMC, DDR, RF, Power)
Plantilla Stencil BGA Reballing para Samsung A13/A21S/A33/A53(A536)/F13/M33 (CPU Exynos1280/E8825/Exynos850/3830, RAM, EMMC, DDR, RF, Power)
Precio habitual
$9.378 CLP
Precio habitual
$12.378 CLP
Precio de oferta
$9.378 CLP
Precio unitario
por
Los gastos de envío se calculan en la pantalla de pago.
No se pudo cargar la disponibilidad de retiro
SPECIFICATIONS
Brand Name: NoEnName_Null
Certification: None
Choice: yes
Model Number: SAM16
Origin: Mainland China
semi_Choice: yes
Welcome to our store
We specialize in integrated circuit chips
If you need to purchase more models
Click on the“Add To Cart”
• Shipping Information
Items will be ship within3 daysof payment receive.
working days(2-4 weeks)to receive for most area.
If you do not receive item within 30 working days(5 weeks), please contact us to investigate the case.
The soldering process is complicated,oldering/replacing chips must be operated by engineers who have proficient skills.
As BGA chips are fragile, complicatedly structured, with numerous balls
any slightly faulty positioning
careless temperature-control or incomplete cleaning PCB boards will result in insufficient soldering or missing soldering.
BGA chips are easily get broken by improper soldering. Before buying, you should consider 3 points:
1) Have you bought the right chips?
2) Do you have proper equipment?
3) Are you skillful enough to solder the chips?
