ElectroCicla
MECHANIC HEAT AIR Preheating Platform PTC Heating Core BGA Stencil For IPhone X-15 Series Motherboard Layered Chip Reflow Weld
MECHANIC HEAT AIR Preheating Platform PTC Heating Core BGA Stencil For IPhone X-15 Series Motherboard Layered Chip Reflow Weld
Precio habitual
$21.106 CLP
Precio habitual
$24.105 CLP
Precio de oferta
$21.106 CLP
Precio unitario
/
por
Los gastos de envío se calculan en la pantalla de pago.
No se pudo cargar la disponibilidad de retiro
SPECIFICATIONS
Brand Name: MECHANIC
Choice: yes
DIY Supplies: ELECTRICAL
Hign-concerned Chemical: None
Origin: Mainland China
Type: Combination
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