ElectroCicla
Pasta de Soldar Estaño RELIFE (Sn63/Pb37, 183°C Media Temperatura) Flux No-Clean Rosin para Reballing BGA/PCB/SMT
Pasta de Soldar Estaño RELIFE (Sn63/Pb37, 183°C Media Temperatura) Flux No-Clean Rosin para Reballing BGA/PCB/SMT
Precio habitual
$11.827 CLP
Precio habitual
$14.827 CLP
Precio de oferta
$11.827 CLP
Precio unitario
por
Los gastos de envío se calculan en la pantalla de pago.
No se pudo cargar la disponibilidad de retiro
SPECIFICATIONS
Brand Name: NoEnName_Null
Certification: None
Model Number: RL-400/RL-401/RL-402/RL-403
Origin: Mainland China
Particle Size: 20-38μm
Features:
1.Viscous and smooth
2.Solder wicking is strong
3.Less residual
4.No clean
5.Paste delicate,Lasting shine,The particle size is only 20-38 micron.
6. solder paste up to 79%
