ElectroCicla
Horno de Reflow Soldadura BGA RF-200A (800W) por Infrarrojos y Aire Caliente para SMD/SMT Rework
Horno de Reflow Soldadura BGA RF-200A (800W) por Infrarrojos y Aire Caliente para SMD/SMT Rework
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SPECIFICATIONS
Brand Name: NoEnName_Null
Certification: CE,FCC
Effective Welding Area: 200*150MM
Heating Method: Both hot air and infrared heat
Hign-concerned Chemical: None
Max Power: 800W
Model Number: RF-200A
Operating Mode: LCD or through PC
Operating System: ENGLISH mode
Origin: Mainland China
Products Name: Reflow Soldering Oven
is_customized: Yes
ITECH SMT 700W Infrared Heating Drawer Type Reflow Oven Soldering Station RF-200A For PCB Prototyp and R&D

Drawer Type Reflow Oven
The ITECH series reflow oven adopts 3D hot air circulation + super infrared radiation heating to make the internal heat flow evenly, which is suitable for the reflow requirements of different alloys and lead-free solders. It is suitable for design and development, experimental teaching, small batch production and processing.
1.The product that will process lightly puts into the even on the stage in the drawer, Close drawer, Press F1 to switch on, The automatic performance make selection of heat wave, Show current performance time,the enactment temperature and measure temperature on the LCD screen, and the automatic formation order form wave.
2. Observed the data,wave of the window and the LCD screen manifestation before passing drawer, in the whole supervision that processed all of process and can see at you, if the request for processing wave to could not reach you can modification parameter.
3. Process the wave is strict to press the different tin syrup different temperature to have pre-established request to the return solder , you can prepare to establish another wave according to the different need.
4.Process process in, if need stop, can press "S" to carry on to terminate compulsory;After put the last hand, the breeze machine auto carries on cooling to the product;You can also start the breeze machine to carry on cooling compulsory.
5. After returning solder completion, If the product existence blemish.can solder again, Can also move the start heating to carry on returning to solder. This machine establishes this function.















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